Interconnect Stress Testing (IST) speeds up temperature cycling to detect susceptibility to early failure, and thereby increases product reliability. It is twelve times faster than in an air-to-air thermal oven, creating the opportunity for greater testing output.
Signal Integrity Testing (SIT) determines the amount of signal propagation caused by the characteristics of the materials, conductors and accompanying structures on the PWB. Losses in the signal will result in frequency-dependent attenuation. UL performs five methods* of SIT testing, such as the particularly beneficial Single-ended TDR method and Differential Insertion Loss (SET2DIL).
Conductive anodic filament failure involves the growth or “electro-chemical-migration” of copper in a PWB. This unintentional growth typically bridges two oppositely biased copper conductors resulting in a short circuit. Catching and correcting this potential failure can substantially lengthen product lifespans.
Conformal coatings are applied to electronic circuits to provide a barrier to moisture and contamination and to provide electrical insulation. UL offers a full suite of coating testing services, including:
- UL 746E evaluations
- IPC-CC-830: Qualification and performance testing of electrical insulating compounds for printed wiring assemblies
- IPC-SM-840: Qualification and performance specification of permanent solder mask and flexible cover materials
- IEC-60664-3: Insulation coordination for equipment within low-voltage systems, via the use of coatings to achieve insulation coordination of printed board performance & assemblies