PWB Testing Services

PWB Testing Services 2017-12-22T00:04:36+00:00

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Explore UL’s range of testing services …

The following list includes commonly requested tests, such as Advanced Analytical Techniques, Chemical Testing, Electrical Testing, Environmental Testing, Flammability Testing, Mechanical & Physical Property Testing and Conformal Coating & Solder Masks.

We also perform many other tests that are not listed. Please contact us about custom testing and designing a test plan to fit your unique needs.

  • Atomic Absorption Spectroscopy (AAS)
  • Ash Content
  • Differential Scanning Calorimetry (DSC),Temperature
  • Dynamic X-Ray (2D or 3D X-Ray)
  • Dynamic Mechanical Analysis (DMA)
  • Energy Dispersive X-Ray Spectroscopy (EDS)
  • Extractions
  • Failure Analysis (F/A)
  • Fourier Transform Infrared Spectroscopy (FTIR)
  • Gas Chromatography / Mass Spectroscopy (GC/MS)
  • Gel Content
  • Ignition Loss
  • Emission Spectroscopy (ICP/OES)Inductively Coupled Plasma Spectroscopy/ Optical
  • Ion Chromatography (IC)
  • Microwave Digestion
  • Scanning Electron Microscopy (SEM)
  • Thermogravimetric Analysis (TGA)
  • X-Ray (Live-time, non-destructive inspection of package)
  • X-Ray Fluorescence (XRF)
  • Alloy Composition
  • Bisphenol A Content
  • Chemical Resistance / Solder Resistance
  • Density/ Specific Gravity
  • Flammability Hazardous Substance Analysis
  • Heavy Metals/Lead Content
  • Ion Chromatography (IC)
  • Organotin Content
  • pH
  • Phthalate Content
  • RoHS
  • Solder Paste – Slump Test
  • Spitting of Flux-Cored Wire Solder
  • Viscosity
  • Arc Resistance
  • Capacitance
  • Comparative Tracking Index (CTI)
  • Conductive Anodic Filament Growth (CAF)
  • Conductivity
  • Dielectric Breakdown
  • Dielectric Constant / Permittivity
  • Dielectric Strength
  • Dielectric Withstanding Voltage (DWV)
  • Dissipation Factor / Loss Tangent
  • Electromigration / Electrochemical Migration (ECM)
  • High-Current Arc Ignition (HAI)
  • High Voltage Arc Tracking
  • Hot Wire Ignition
  • Inclined Plane Tracking
  • Interconnect Stress Test
  • Resistance
  • Signal Integrity Testing (SIT) / SET2DIL / TDR
  • Surface Insulation Resistance (SIR) / Insulation Resistance
  • Volume and Surface Resistivity
  • Accelerated Aging
  • Altitude
  • Autoclave (Pressure Vessel)
  • Conductive Anodic Filament (CAF)
  • Chemical Resistance
  • Cold Impact
  • Corrosion Resistance
  • Drop/Impact
  • Drop Resistance
  • Electromigration / Electrochemical Migration (ECM)
  • Flammability
  • Fluid Resistance
  • Fungus Resistance
  • Humidity (Cycling or Steady State)
  • Hydrolytic Stability
  • Immersion
  • Interconnect Stress Test
  • IP (Ingress Protection)
  • Moisture and Insulation Resistance (MIR)
  • Moisture Absorption
  • Moisture Resistance
  • Oxygen Index
  • Salt Spray/Fog
  • Solvent Resistance
  • Temperature/Humidity
  • Thermal Aging (UL)
  • Thermal Cycling
  • Thermal Shock
  • Thermal Stress
  • Time to Delamination
  • UV Exposure
  • Vicat Softening Point
  • Water Spray
  • Water Vapor Transmission / Water Absorption
  • Weathering
  • Burning Rate ASTM D 229, Sections 61-66 (Method I/Vertical)
  • Burning Rate ASTM D 635 (Horizontal)
  • Burning Rate FAA 25.853b5 (Horizontal)
  • Burning Rate FMVSS 302 (49CFR571) (Horizontal)
  • Burning Rate ISO 3795 (Horizontal)
  • Burning Rate UL 94 HB (Horizontal)
  • Burning Rate UL 94 HBF (Horizontal)
  • Burning Rate UL 94 5V (Vertical)
  • Burning Rate UL 94 V (Vertical)
  • Burning Rate UL 94 VTM (Vertical)
  • Flammability,Small Component, UL 1694
  • Oxygen Index ASTM D 2863(Procedure A/Test Method A)
  • Abrasion
  • Adhesion
  • Bend Testing
  • Bond Strength
  • Bow and Twist
  • Breaking Strength
  • Brittleness
  • Coating Thickness
  • Coefficient of Friction
  • Coefficient of Thermal Expansion (CTE)
  • Compression Set
  • Compressive Strength
  • Compression Properties
  • Cross-section Analysis
  • Cure
  • Deflection Under Load
  • Deformation Temperature
  • Dimensional Stability
  • Dynamic Mechanical Analysis (DMA)
  • Elongation
  • Flexural Strength and Modulus
  • Glass Transition Temperature by TMA
  • Hardness
  • Impact Strength
  • Impact Resistance
  • Lap Shear Strength
  • Mechanical Cycling
  • Mechanical Strength
  • Microsectioning
  • Peel Strength
  • Plating Thickness
  • Rework Simulation
  • Shear Properties
  • Shear Strength
  • Softening Point
  • Specific Gravity / Density
  • Tear Resistance
  • Tensile Impact
  • Tensile Strength
  • Tensile Properties
  • Tension and Compression
  • Young’s Modulus
  • Abrasion (Taber)
  • Adhesion
  • Appearance
  • Coating Thickness
  • Cure Time & Temperature
  • Dielectric Strength
  • Dielectric Withstanding Voltage (DWV)
  • Electrochemical Migration
  • Flammability
  • Flexibility
  • Flourescence
  • Fourier Transform Infrared Spectroscopy (FTIR)
  • Fungus Resistance
  • Hardness
  • Hydrolytic Stability
  • Insulation Resistance
  • Lap Shear
  • Moisture Insulation Resistance
  • Peel Strength
  • Q-Resonance
  • Resistance to Chemicals,Solvents and Cleaning Agents
  • Shelf Life
  • Tensile Strength
  • Thermal Shock
  • Thermal Stress
  • Viscosity
  • Visual Requirements

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